+86-512 66386808
All Categories

Silicone Potting Compound

Home >  Products >  Thermal Conductive Products  >  Silicone Potting Compound

Potting Compound Potting Compound for electronics silicone potting compound

Description

Volsun

 

Potting Compound is a high-quality, silicone-based material designed to protect electronics from harsh environmental conditions. It is ideal for various applications, including electrical and electronic insulation, waterproofing, and encapsulation.

 

This Potting Compound is made with a unique formulation of high-performance Volsun silicone, ensuring it offers excellent insulation and protection against moisture, heat, and chemicals. It is specially designed to provide superior adhesion to electronic components and PCBs.

 

Volsun Potting Compound is easy to use since it doesn't require any additional equipment to apply. It cures quickly and has a long term stability, meaning it can last for an extended period without any replacement.

 

One of the significant advantages of Volsun Potting Compound is its ability to withstand harsh environmental conditions, such as extreme temperatures, UV radiation, and even corrosive substances. This feature makes it ideal for applications that require protection against harsh outdoor environments.

 

The Potting Compound is also highly resistant to mechanical stress, making it ideal for use in high-vibration environments. It provides excellent encapsulation and protection against physical damage due to its softness.

 

Unlike other Potting Compounds, Volsun Potting Compound is non-toxic and safe to use. It's also non-flammable, which ensures it offers protection against fire hazards.

 

The product is available in different colors and viscosities, allowing users to choose the ideal variant depending on the application. The Potting Compound is also flexible, making it suitable for applications that require flexibility.

 

Volsun Potting Compound is an excellent alternative to traditional Potting Compounds since it offers superior performance and durability. It can be used on various electronic devices, including LED lighting, sensors, and even medical devices.

 



Product Overview

Potting Compound Potting Compound for electronics silicone potting compound

Description
VS-TP2001 is a two-component 1: 1 type heat-curing silicone thermally conductive liquid form able gel material that cures at room temperature or after heating to form an elastic thermally conductive silicone rubber, specially designed for the manufacture of electrical and electronic products and modules, such as high Potting protection of power supply modules, frequency converters, sensors, etc., connection and fixation between automotive electronic devices and PCB, etc.

Features
*  Continuous operating temperature:-70℃~+200℃
*  Excellent mechanical properties and extensibility
*  Excellent thermal conductivity and aging resistance
*  Low viscosity, self-leveling, excellent drilling ability
*  Low modulus, low stress, good adhesion to both metals and plastics
PRODUCT SPECIFICATIONS
Item
Typical Data
Test Method
Mixing ratio
1: 1
/
Color(After mixing) 
Grey
Visual
Viscosity (Component A) @25℃
7000-9000cps
ASTM D2196
Viscosity (Component B) @25℃
7000-9000cps
ASTM D2196
Viscosity (After mixing) @25℃
7000-9000cps
ASTM D2196
Opening hours @25℃
≥60min
/
Curing condition
30min/50℃;20min/100℃
/
Thermal Conductivity
2.0±0.2 W/m·k
ASTM D5470
Hardness
45±5 Shore A
GB/T 531.1-2008
Density
2.8±0.2 g/cm3
GB/T 1033.1-2008
Tensile strength
>0.2MPa
GB/T 528-2009
Elongation at break
>10%
GB/T 528-2009
Flame retardance
V-0
UL94
Breakdown strength
≥10 kV/mm
GB/T 1695-2005
Volume resistivity
≥ 1.0×1013 Ω·cm
GB/T 1692-2008
Applications


Dimensions

Size
Package
VS-TP2001(1kg 
Component A: 0.5kg; Component B: 0.5kg
VS-TP2001(20kg)
Component A: 10kg; Component B: 10kg
VS-TP2001(40kg)
Component A: 20kg; Component B: 20kg
VS-TP2001(80kg)
Component A: 40kg; Component B: 40kg
VS-TP2001(100kg)
Component A: 50kg; Component B: 50kg

Note Special size and packing are available as request.


Instructions
*  A and B components are stirred separately
*  Mixing the well-stirred components A and B according to the ratio of 1: 1 (volume ratio/weight ratio can be used) well
*  The mixed compound is poured into the device which need to be sealed, then static curing (Can be cured at room temperature or by heating)
Precautions
*  In order to ensure the uniform distribution of fillers, components A and B must be stirred separately before mixing, so that each compounding agent is evenly mixed.
*  After A and B are mixed, they will react and cure each other, so they need to be used up after mixing, and they cannot be used twice after mixing and curing
*  When pouring into the protective part, there should be no large debris or other contaminants in the protective part to avoid affecting the mutual adhesion of the material and the object
*  Before the material is fully cured, avoid other objects contacting the material, affecting the appearance and protective
 performance of the material

*  This product should not be in the mouth and eyes. If it accidentally enters the mouth and eyes, rinse it with water in time or go to the hospital for medical treatment.

*  If need high thermal conductivity, vacuum degassing is required before pouring

*  In low temperature environment, the curing time will be extended accordingly
Storage conditions Shelf life
*  The product should be stored in the original packaging, keeping the lid tightly closed to avoid contamination (Temperature: 15℃<T<30℃; Relative Humidity: RH<70%)
*  Shelf life is 9 months from the date of manufacture

Company Show
Certifications
Abroad Exhibition
Las Vagas AAPEX
Moscow Expo
Hannover Messe

Get a Free Quote

Our representative will contact you soon.
Email
Name
Company Name
Message
0/1000
WhatsApp WhatsApp
WhatsApp
Email Email Tel Tel TopTop