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Silicone Potting Compound

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High Quality Waterproof Thermal Conductivity Silicone Potting Compound For Electronics

Description

Volsun

 

Proud to present their High Quality Waterproof Thermal Conductivity Silicone Potting Compound for Electronics. This product is designed to protect electronic components from moisture and water damage, while also providing an excellent thermal conductivity to help prevent overheating.

 

The potting compound is made from high-quality silicone, which is a synthetic material that is known for its durability and resistance to environmental factors. Silicone  Volsun is also known to have a high thermal conductivity, making it an ideal material for potting compounds.

 

The Volsun potting compound is waterproof, meaning that it can protect electronic components from any water damage or moisture that may be present. This is especially important for outdoor applications, such as solar panels, that are often subject to rain and other environmental factors.

 

The thermal conductivity of the potting compound is also exceptional, meaning that it is able to transfer heat away from the electronic components quickly and efficiently. This helps to prevent overheating, which can cause damage to the components and reduce their lifespan.

 

In addition to its protective and thermal conductivity properties, the Volsun potting compound is also easy to use. It is a two-part compound that is supplied in pre-measured amounts, making it easy to mix and apply. The potting compound is also self-leveling, which ensures that it will fill all voids and gaps in the electronic components.

 


Product Overview

Potting Compound Potting Compound for electronics silicone potting compound

Description
VS-TP2001 is a two-component 1: 1 type heat-curing silicone thermally conductive liquid forma ble gel material that cures at room temperature or after heating to form an elastic thermally conductive silicone rubber, specially designed for the manufacture of electrical and electronic products and modules, such as high Potting protection of power supply modules, frequency converters, sensors, etc., connection and fixation between automotive electronic devices and PCB, etc.

Features
*  Continuous operating temperature:-70℃~+200℃
*  Excellent mechanical properties and extensibility
*  Excellent thermal conductivity and aging resistance
*  Low viscosity, self-leveling, excellent drilling ability
*  Low modulus, low stress, good adhesion to both metals and plastics
PRODUCT SPECIFICATIONS
Item
Typical Data
Test Method
Mixing ratio
1: 1
/
Color(After mixing) 
Grey
Visual
Viscosity (Component A) @25℃
7000-9000cps
ASTM D2196
Viscosity (Component B) @25℃
7000-9000cps
ASTM D2196
Viscosity (After mixing) @25℃
7000-9000cps
ASTM D2196
Opening hours @25℃
≥60min
/
Curing condition
30min/50℃;20min/100℃
/
Thermal Conductivity
2.0±0.2 W/m·k
ASTM D5470
Hardness
45±5 Shore A
GB/T 531.1-2008
Density
2.8±0.2 g/cm3
GB/T 1033.1-2008
Tensile strength
>0.2MPa
GB/T 528-2009
Elongation at break
>10%
GB/T 528-2009
Flame retardance
V-0
UL94
Breakdown strength
≥10 kV/mm
GB/T 1695-2005
Volume resistivity
≥ 1.0×1013 Ω·cm
GB/T 1692-2008


Dimensions

Size
Package
VS-TP2001(1kg)
Component A: 0.5kg; Component B: 0.5kg
VS-TP2001(20kg)
Component A: 10kg; Component B: 10kg
VS-TP2001(40kg)
Component A: 20kg; Component B: 20kg
VS-TP2001(80kg)
Component A: 40kg; Component B: 40kg
VS-TP2001(100kg)
Component A: 50kg; Component B: 50kg

Note:Special size and packing are available as request.


Instructions
*  A and B components are stirred separately
*  Mixing the well-stirred components A and B according to the ratio of 1: 1 (volume ratio/weight ratio can be used) well
*  The mixed compound is poured into the device which need to be sealed, then static curing (Can be cured at room temperature or by heating)

Precautions
*  In order to ensure the uniform distribution of fillers, components A and B must be stirred separately before mixing, so that each compounding agent is evenly mixed.
*  After A and B are mixed, they will react and cure each other, so they need to be used up after mixing, and they cannot be used twice after mixing and curing.
*  When pouring into the protective part, there should be no large debris or other contaminants in the protective part to avoid affecting the mutual adhesion of the material and the object
*  Before the material is fully cured, avoid other objects contacting the material, affecting the appearance and protective
 performance of the material
*  This product should not be in the mouth and eyes. If it accidentally enters the mouth and eyes, rinse it with water in time or go to the hospital for medical treatment.
*  If need high thermal conductivity, vacuum degassing is required before pouring
*  In low temperature environment, the curing time will be extended accordingly

Storage conditions Shelf life

*  The product should be stored in the original packaging, keeping the lid tightly closed to avoid contamination (Temperature: 15℃<T<30℃; Relative Humidity: RH<70%)

*  Shelf life is 9 months from the date of manufacture

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