* Excellent mechanical properties and extensibility
* Excellent thermal conductivity and aging resistance
* Low viscosity, self-leveling, excellent drilling ability
* Low modulus, low stress, good adhesion to both metals and plastics
Volsun
Proud to present their High Quality Waterproof Thermal Conductivity Silicone Potting Compound for Electronics. This product is designed to protect electronic components from moisture and water damage, while also providing an excellent thermal conductivity to help prevent overheating.
The potting compound is made from high-quality silicone, which is a synthetic material that is known for its durability and resistance to environmental factors. Silicone Volsun is also known to have a high thermal conductivity, making it an ideal material for potting compounds.
The Volsun potting compound is waterproof, meaning that it can protect electronic components from any water damage or moisture that may be present. This is especially important for outdoor applications, such as solar panels, that are often subject to rain and other environmental factors.
The thermal conductivity of the potting compound is also exceptional, meaning that it is able to transfer heat away from the electronic components quickly and efficiently. This helps to prevent overheating, which can cause damage to the components and reduce their lifespan.
In addition to its protective and thermal conductivity properties, the Volsun potting compound is also easy to use. It is a two-part compound that is supplied in pre-measured amounts, making it easy to mix and apply. The potting compound is also self-leveling, which ensures that it will fill all voids and gaps in the electronic components.
Item |
Typical Data |
Test Method |
Mixing ratio |
1: 1 |
/ |
Color(After mixing) |
Grey |
Visual |
Viscosity (Component A) @25℃ |
7000-9000cps |
ASTM D2196 |
Viscosity (Component B) @25℃ |
7000-9000cps |
ASTM D2196 |
Viscosity (After mixing) @25℃ |
7000-9000cps |
ASTM D2196 |
Opening hours @25℃ |
≥60min |
/ |
Curing condition |
30min/50℃;20min/100℃ |
/ |
Thermal Conductivity |
2.0±0.2 W/m·k |
ASTM D5470 |
Hardness |
45±5 Shore A |
GB/T 531.1-2008 |
Density |
2.8±0.2 g/cm3 |
GB/T 1033.1-2008 |
Tensile strength |
>0.2MPa |
GB/T 528-2009 |
Elongation at break |
>10% |
GB/T 528-2009 |
Flame retardance |
V-0 |
UL94 |
Breakdown strength |
≥10 kV/mm |
GB/T 1695-2005 |
Volume resistivity |
≥ 1.0×1013 Ω·cm |
GB/T 1692-2008 |
Size |
Package |
VS-TP2001(1kg) |
Component A: 0.5kg; Component B: 0.5kg |
VS-TP2001(20kg) |
Component A: 10kg; Component B: 10kg |
VS-TP2001(40kg) |
Component A: 20kg; Component B: 20kg |
VS-TP2001(80kg) |
Component A: 40kg; Component B: 40kg |
VS-TP2001(100kg) |
Component A: 50kg; Component B: 50kg |
Storage conditions Shelf life
* The product should be stored in the original packaging, keeping the lid tightly closed to avoid contamination (Temperature: 15℃<T<30℃; Relative Humidity: RH<70%)
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